A study on the characteristics of typical bonding wires for MIC and MMIC considering packaging effects
Vol. 24, No. 11, pp. 2096-2101, Nov. 1999
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Cite this article
[IEEE Style]
박종국 and 남상욱, "A study on the characteristics of typical bonding wires for MIC and MMIC considering packaging effects," The Journal of Korean Institute of Communications and Information Sciences, vol. 24, no. 11, pp. 2096-2101, 1999. DOI: .
[ACM Style]
박종국 and 남상욱. 1999. A study on the characteristics of typical bonding wires for MIC and MMIC considering packaging effects. The Journal of Korean Institute of Communications and Information Sciences, 24, 11, (1999), 2096-2101. DOI: .
[KICS Style]
박종국 and 남상욱, "A study on the characteristics of typical bonding wires for MIC and MMIC considering packaging effects," The Journal of Korean Institute of Communications and Information Sciences, vol. 24, no. 11, pp. 2096-2101, 11. 1999.
pISSN : 1226 - 4717
eISSN : 2287 - 3880