On the 2D Vision Inspection Algorithm for Semiconductor Chip Package 


Vol. 31,  No. 12, pp. 1157-1164, Dec.  2006


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  Abstract

In this paper, we proposed a method for measuring accurate positions and sizes of package and balls in a micro BGA. To find defects of BGA accurately, we focused on finding positions of package and balls. After labeling, we detected connected components of package and balls using feature parameters. After the detection of package component, we measured position and size of package by employing rectangular model which was constructed by the package information. After the detection of the ball components, we measured positions and diameters of balls by employing circular models which were constructed by the ball informations. We did calibration based on landmarks to measure real length, and we compared the measured results with the SEM data. Finally, we found that the accuracy of the proposed method is 94% in terms of ball's radius.

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  Cite this article

[IEEE Style]

S. Yu and Y. Kim, "On the 2D Vision Inspection Algorithm for Semiconductor Chip Package," The Journal of Korean Institute of Communications and Information Sciences, vol. 31, no. 12, pp. 1157-1164, 2006. DOI: .

[ACM Style]

Sang-Hyun Yu and Yong-Kwan Kim. 2006. On the 2D Vision Inspection Algorithm for Semiconductor Chip Package. The Journal of Korean Institute of Communications and Information Sciences, 31, 12, (2006), 1157-1164. DOI: .

[KICS Style]

Sang-Hyun Yu and Yong-Kwan Kim, "On the 2D Vision Inspection Algorithm for Semiconductor Chip Package," The Journal of Korean Institute of Communications and Information Sciences, vol. 31, no. 12, pp. 1157-1164, 12. 2006.

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pISSN : 1226 - 4717
eISSN : 2287 - 3880