Bonding Method and Packaging of High Temperature RFID Tag 


Vol. 35,  No. 1, pp. 62-67, Jan.  2010


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  Abstract

Our research group has investigated that RFID tag packaging development and RFID tag flip chip bonding method influences on the industry-environmental customized RFID tag development that has applications to various industry environmental conditions. RFID tag flip chip bonding is consisting with wire bonding, ultrasonic bonding, heat plate bonding, and laser bonding and those methods are also depending on the different RFID tag development. Our research data shows that, among the various industrial environments such as an extremely high temperature, cryogenic, high-humidity, flexible, high-durable, development of RFID tag in an extremely high temperature is inappropriate for laser bonding method, converting of heat energy as absorbing light energy or heat plate bonding method of straight heat transferring manner, on the other hand, is suitable for wire bonding method which directly connect bump to pattern using wire.

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  Cite this article

[IEEE Style]

E. Choi, D. Yoo, J. Byun, D. Ju, B. Sung, B. Cho, "Bonding Method and Packaging of High Temperature RFID Tag," The Journal of Korean Institute of Communications and Information Sciences, vol. 35, no. 1, pp. 62-67, 2010. DOI: .

[ACM Style]

Eun-jung Choi, Dea-won Yoo, Jong-hun Byun, Dae-keun Ju, Bong-gun Sung, and Byung-lok Cho. 2010. Bonding Method and Packaging of High Temperature RFID Tag. The Journal of Korean Institute of Communications and Information Sciences, 35, 1, (2010), 62-67. DOI: .

[KICS Style]

Eun-jung Choi, Dea-won Yoo, Jong-hun Byun, Dae-keun Ju, Bong-gun Sung, Byung-lok Cho, "Bonding Method and Packaging of High Temperature RFID Tag," The Journal of Korean Institute of Communications and Information Sciences, vol. 35, no. 1, pp. 62-67, 1. 2010.

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pISSN : 1226 - 4717
eISSN : 2287 - 3880