Thermal Analysis and Optimization of 6.4 W Si-Based Multichip LED Packaged Module
Vol. 39, No. 3, pp. 234-238, Mar. 2014
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Cite this article
[IEEE Style]
Z. Chuluunbaatar and N. Y. Kim, "Thermal Analysis and Optimization of 6.4 W Si-Based Multichip LED Packaged Module," The Journal of Korean Institute of Communications and Information Sciences, vol. 39, no. 3, pp. 234-238, 2014. DOI: .
[ACM Style]
Zorigt Chuluunbaatar and Nam Young Kim. 2014. Thermal Analysis and Optimization of 6.4 W Si-Based Multichip LED Packaged Module. The Journal of Korean Institute of Communications and Information Sciences, 39, 3, (2014), 234-238. DOI: .
[KICS Style]
Zorigt Chuluunbaatar and Nam Young Kim, "Thermal Analysis and Optimization of 6.4 W Si-Based Multichip LED Packaged Module," The Journal of Korean Institute of Communications and Information Sciences, vol. 39, no. 3, pp. 234-238, 3. 2014.