Best Papers
 Multiple Defect pattern Recognition in a Wafer Map Using Vector-Representation Based Capsule Network 


Vol. 48,  No. 9, pp. 1179-1189, Sep.  2023
10.7840/kics.2023.48.9.1179


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  Abstract

To satisfy the demand of semiconductor market, the semiconductor manufacturing process should guarantee the production of high-yield and high-quality semiconductors. The fabrication process is complexly compound of several sub-processes, and thus even if an experienced engineer manages the process with precise equipment in a clean environment, it is difficult to make a wafer with no error-free dies. Therefore, the engineer should quickly discover which sub-process is mal-functioning for high yield. Fortunately, error dies make a specific defect pattern, which corresponds to specific abnormal operation of some fabrication sub-processes. Hence, a scheme that recognizes defect patterns in a wafer map can allow fabrication engineers to make the high-quality wafer with few error dies. In this paper, we implement a capsule network based multiple-defect recognition scheme with high precision and recall per each defect pattern. This work is the first to exploit a vector-representation based network for the recognition of defects in a wafer map, and verifies that the network using vector representation shows higher performance compared to the convontional feature-map based networks.

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[IEEE Style]

M. Kim, J. H. Choi, H. Lee, "Multiple Defect pattern Recognition in a Wafer Map Using Vector-Representation Based Capsule Network," The Journal of Korean Institute of Communications and Information Sciences, vol. 48, no. 9, pp. 1179-1189, 2023. DOI: 10.7840/kics.2023.48.9.1179.

[ACM Style]

Misun Kim, Ji Hwan Choi, and Harim Lee. 2023. Multiple Defect pattern Recognition in a Wafer Map Using Vector-Representation Based Capsule Network. The Journal of Korean Institute of Communications and Information Sciences, 48, 9, (2023), 1179-1189. DOI: 10.7840/kics.2023.48.9.1179.

[KICS Style]

Misun Kim, Ji Hwan Choi, Harim Lee, "Multiple Defect pattern Recognition in a Wafer Map Using Vector-Representation Based Capsule Network," The Journal of Korean Institute of Communications and Information Sciences, vol. 48, no. 9, pp. 1179-1189, 9. 2023. (https://doi.org/10.7840/kics.2023.48.9.1179)
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pISSN : 1226 - 4717
eISSN : 2287 - 3880