Passivation Thickness Control and Open Pad Design to Reduce Crack in COG Package 


Vol. 32,  No. 12, pp. 408-412, Dec.  2007


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  Abstract

Package reliability test was conducted to investigate the effect of passivation thickness and open pad on the gold bump fatigue strength for Flip chip Package. The shear strength of the gold bump was increased with the in passivation thickness prior to the UBM metal deposition in the flip chip structure. The shear strength of l.0㎛ for open pad was larger than that of 0.6㎛ for open pad. The main fracture path in the shear test was the interface between UBM metal films and the open pad when the peel strength be low. The reliability of the gold bumps was improved as the adhesion strength between UBM thin metal and open pad increases. SEM (scanning electron microscope) was used to the analyze failure mechanics. The degradation of shear strength of gold bumps caused by passivation thickness and size of open pad was discussed.

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  Cite this article

[IEEE Style]

K. Kim, H. Lee, W. Lee, "Passivation Thickness Control and Open Pad Design to Reduce Crack in COG Package," The Journal of Korean Institute of Communications and Information Sciences, vol. 32, no. 12, pp. 408-412, 2007. DOI: .

[ACM Style]

Kyeong-Su Kim, Ho-Woong Lee, and Woo-Sang Lee. 2007. Passivation Thickness Control and Open Pad Design to Reduce Crack in COG Package. The Journal of Korean Institute of Communications and Information Sciences, 32, 12, (2007), 408-412. DOI: .

[KICS Style]

Kyeong-Su Kim, Ho-Woong Lee, Woo-Sang Lee, "Passivation Thickness Control and Open Pad Design to Reduce Crack in COG Package," The Journal of Korean Institute of Communications and Information Sciences, vol. 32, no. 12, pp. 408-412, 12. 2007.

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pISSN : 1226 - 4717
eISSN : 2287 - 3880