Development of Zigbee Based Real-Time Soldering-Iron Device Status Monitoring Platform 


Vol. 48,  No. 1, pp. 94-106, Jan.  2023
10.7840/kics.2023.48.1.94


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  Abstract

In this paper, we developed a system to measure and monitor the state of the Soldering-iron device used for re-work of defective products among printed circuit board(PCB) products put into functional tests after the in-circuit tester(ICT) process in the production line. A system was established that measures the leakage current, surge voltage, and tip temperature data generated by the iron in real time and transmits it to the dedicated monitoring S/W using the Zigbee communication interface. In order to objectively compare and analyze the data measurement performance of the proposed development platform, the same Soldering-iron device was used and the performance analysis was conducted under the same conditions as the existing Soldering-iron tester. As a result of the performance analysis, the measurement ranges of temperature, leakage current and surge voltage showed similar results, and in the measurement resolution, the development platform proposed by each of the surge voltage and leakage current showed 10 times improvement compared to the existing soldering-iron tester. In terms of temperature measurement resolution, the proposed development platform showed a 4 times improvement compared to the existing Soldering-iron tester. The proposed development platform applied the Zigbee based real-time wireless transmission function, which was not applied to the existing Soldering-iron tester, and was implemented in two ways: the broadcasting method and the polling-ack method in a 1:N environment to verify the actual effectiveness. In addition, the maximum number of simultaneous connections to ZigBee nodes of each method, simultaneous measurement of surge voltage data, time required for simultaneous connection, and connection maintenance time were compared through the monitoring program. Compared to the broadcasting communication method, the polling-ack communication method increases the maximum number of simultaneous node connections and the number of simultaneous measurements of surge current data per unit period, and reduces the time required for simultaneous connection when connecting 1:7.

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[IEEE Style]

R. Kim, S. Oh, J. Kim, "Development of Zigbee Based Real-Time Soldering-Iron Device Status Monitoring Platform," The Journal of Korean Institute of Communications and Information Sciences, vol. 48, no. 1, pp. 94-106, 2023. DOI: 10.7840/kics.2023.48.1.94.

[ACM Style]

Rae-Hyeon Kim, Sung-Hyun Oh, and Jeong-Gon Kim. 2023. Development of Zigbee Based Real-Time Soldering-Iron Device Status Monitoring Platform. The Journal of Korean Institute of Communications and Information Sciences, 48, 1, (2023), 94-106. DOI: 10.7840/kics.2023.48.1.94.

[KICS Style]

Rae-Hyeon Kim, Sung-Hyun Oh, Jeong-Gon Kim, "Development of Zigbee Based Real-Time Soldering-Iron Device Status Monitoring Platform," The Journal of Korean Institute of Communications and Information Sciences, vol. 48, no. 1, pp. 94-106, 1. 2023. (https://doi.org/10.7840/kics.2023.48.1.94)
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pISSN : 1226 - 4717
eISSN : 2287 - 3880